Polishing Slurryï¼AlâOâï¼ minangka slurry silika koloid sing dikembangake utamane kanggo polishing keramik, lan substrat elektronik kayata lithium tantalate (LiTaO3), lithium niobate (LiNbO3), lan'Glass Photomask, Ferrite Ceramics, Ni-P Disk, Kristal, Keramik PZT, Keramik Barium Titanate, Silikon Bare, Keramik Alumina, CaF2, Rework Wafer Silikon Bare, Keramik SiC, Safir, Substrat Elektronik, Keramik, Kristal. Kanthi keseragaman lan dispersal partikel sing apik, menehi tingkat penghapusan sing dhuwur lan polishing tanpa karusakan.
Ditrapake kanggo proses polishing materi Sapphire utawa SIC super-hardcover, antarmuka manungsa-mesin kanggo nggampangake operasi, awak kanggo ngiyataken desain bar support, stabilitas luwih, karo fungsi cooling banyu.
Silicon Carbide Wafer Thinning Machine utamané digunakake kanggo thinning bahan substrat kayata wafer silikon, gallium arsenide, keramik karbida silikon, keramik zirconia, grafit, litium tantalate lan liya-liyane.
Iku cocok kanggo lumahing mecah saka dhuwur-tliti workpieces gedhe. Kayata: piring plastik, keramik, paduan nikel, piring paduan seng, piring baja tungsten, paduan aluminium, stainless steel, kasus mesin, piring pandhuan cahya, lsp.
Apa sing bisa ditindakake dening Mesin Lapping Double Side ï¼Ditrapake kanggo bahan tipis lan rapuh kayata dering sealing logam, sapir, SiC, keramik, proses penggilingan lan polishing kaca, kontrol tekanan papat tahap, supaya ora ngrusak pangolahan bahan.
Bubur polishing wafer & semikonduktor yaiku slurry silika koloid sing dikembangake utamane kanggo polishing keramik, lan substrat elektronik kayata lithium tantalate (LiTaO3), lithium niobate (LiNbO3), lan'Glass Photomask, Ferrite Ceramics, Ni-P Disk, Crystal, PZT Ceramics , Keramik Barium Titanate, Silikon Bare, Keramik Alumina, CaF2, Rework Wafer Silikon Bare, Keramik SiC, Safir, Substrat Elektronik, Keramik, Kristal. Kanthi keseragaman lan dispersal partikel sing apik, menehi tingkat penghapusan sing dhuwur lan polishing tanpa karusakan.