grace@lapping-machine.com
+86-13622378685

Mesin Penggiling Wafer Semi Otomatis

Peralatan Pangolahan Wafer
Aplikasi saka Peralatan Pangolahan Wafer: Semikonduktor wafer grinding utawa back-thinning saka bahan canggih, kayata: SiC, GaAs, Sapphire, Si, GaN, InP.
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Ultra-Tipis Grinding
Aplikasi Grinding Ultra-Thin: Grinding Ultra-Thin utawa back-thinning saka bahan canggih, kayata: SiC, GaAs, Sapphire, Si, GaN, InP.
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Semikonduktor Wafer Grinder
Aplikasi saka Semiconductor Wafer Grinder: Semikonduktor wafer grinding utawa back-thinning saka bahan canggih, kayata: SiC, GaAs, Sapphire, Si, GaN, InP.â¢ Komponen optik ultra-presisi, kayata kaca ULE, High - Sintilator partikel energi, Film Fluorescent, Kaca proyeksi.
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+86-13622378685

grace@lapping-machine.com